Method of manufacturing a device, device, non-contact type card medium, and electronic equipment

ABSTRACT

Wirings  2 B 1  are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate  5  having a predetermined repellent property, bonding an insulating layer  4 B 1  to the wirings  2 B 1  with an adhesive material  3 B 1  therebetween, peeling and removing the provisional substrate  5 , and bonding and fixing the wirings  2 B 1  together with the insulating film  4 B 1  to a main substrate  1  by an adhesive material  3 B 1.

BACKGROUND OF THE INVENTION

[0001] 1. Technical Filed

[0002] The present invention relates to a method of manufacturing adevice, a device, a non-contact type card medium, and electronicequipment.

[0003] 2. Related Art

[0004] As well known, the photolithographic method is generally used toform printed-circuit boards incorporated into various electronicequipment and wiring patterns in various semiconductor devices. Thephotolithographic method comprises using an etching processing torepeatedly leave only necessary portions on a film formed on a substrateand remove remaining portions to form various circuit elements andwiring patterns on the substrate. Such a photolithographic method usesthe etching processing to repeatedly remove many portions of the film,and so involves a disadvantage that a material for formation of a filmis wasted. As a method of overcoming such disadvantage, there has beenproposed a method of directly forming a wiring pattern in a paintingmanner by the use of an ink jet system to continuously discharge aconductive liquid sequentially and locally on a substrate.

[0005] However, the method of forming a wiring pattern with the use ofthe ink jet system involves the following problems. More specifically,since a repellent property is required of a substrate, on which aconductive liquid is discharged, in forming a fine wiring pattern havinga large film thickness, it is necessary to subject a surface of asubstrate to surface preparation for ensuring a repellent property as apretreatment, and so such surface preparation makes a manufacturingprocess complex. Also, in order to impart a repellent property of acertain level to various kinds of substrates, it is necessary to searchfor conditions of surface preparation conforming to a material of anassociated substrate, and to set conditions of surface preparationconforming to a substrate material when an actual wiring pattern isformed. Also, some substrate materials cannot realize conditions ofsurface preparation for imparting a repellent property of a certainlevel, that is, some substrate materials make conditions of surfacepreparation very difficult. Further, while it has been proposed to usethe ink jet system to form an interlayer insulating film in the case offorming multilayer wirings, a manufacturing process is made complexbecause it is necessary to form a wiring pattern by carrying out thesurface preparation every time an interlayer insulating film is formed.

[0006] Meanwhile, in the case where the ink jet system is used to form awiring pattern, a conductive liquid discharged onto a substrate surfacemust be converted into a conductive film with heat treatment, and sosubstrate materials are required to endure such heat treatment. Forexample, a substrate made of plastics does not posses resistance to theheat treatment, so that it cannot be employed in a method of forming awiring pattern with the ink jet system.

[0007] The invention has been provided in view of the above problems,and has the following objects.

[0008] To form a favorable wiring pattern irrespective of a quality of asubstrate material with the use of the ink jet system.

[0009] (2) To form a wiring pattern by the use of the ink jet systemwithout performing surface preparation for imparting a repellentproperty of a certain level.

[0010] (3) To simplify the steps of forming a multilayer wiring with theuse of the ink jet system.

SUMMARY

[0011] To attain the objects, the invention adopts, as a first aspectrelating to a method of manufacturing a device, a configurationcomprising the steps of (a) forming first wirings on a provisionalsubstrate, (b) mounting an insulating body on the first wirings to forma laminated body of the first wirings and the insulating body, (c)peeling off the laminated body from the provisional substrate, and (d)mounting the laminated body on a main substrate.

[0012] Also, in a second aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which in the step (a),before the first wirings are formed, a surface of the provisionalsubstrate possesses a property permitting the first wirings and theprovisional substrate to peel off in the step (c).

[0013] In a third aspect relating to a method of manufacturing a device,there is adopted a configuration, in which the property permittingpeeling off comprises a repellent property.

[0014] In a fourth aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which in the step (a), thefirst wirings are formed by means of a droplet discharge method.

[0015] In a fifth aspect relating to a method of manufacturing a device,there is adopted a configuration, in which the step (b) comprisesbonding an insulating film to the first wirings.

[0016] In a sixth aspect relating to a method of manufacturing a device,there is adopted a configuration, in which in the step (d), secondwirings are initially formed on the main substrate and the laminatedbody is mounted on the main substrate in a manner to provide conductionbetween the second wirings and the first wirings.

[0017] In a seventh aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which in the step (d),circuit terminals are first formed on the main substrate and thelaminated body is mounted on the main substrate in a manner to provideconduction between the circuit terminals and the first wirings.

[0018] In a eighth aspect relating to a method of manufacturing adevice, there is adopted a configuration of the method of manufacturinga device, wherein openings are formed on the insulating body to exposeat least a part of the first wirings.

[0019] In a ninth aspect relating to a method of manufacturing a device,there is adopted a configuration, in which the openings are first formedon the insulating body prior to the step (b).

[0020] In a tenth aspect relating to a method of manufacturing a device,there is adopted a configuration further comprising, after the step (d),a step (e) of forming a conductive layer on the openings.

[0021] In an eleventh aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which the step (e) iseffected by means of a droplet discharge method.

[0022] In a twelfth aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which the droplets compriseliquid bodies containing fine metallic particles.

[0023] In a thirteenth aspect relating to a method of manufacturing adevice, there is adopted a configuration, in which multilayer wiringsare formed by forming at least one or more new laminated bodies formedin the same step as that, in which the laminated body is formed, on thelaminated body.

[0024] Further, the invention adopts, in aspects relating to a device, aconfiguration, in which the device is manufactured according to themethod of manufacturing a device described above.

[0025] Also, the invention adopts, in aspects relating to a non-contacttype card medium, a configuration, in which an antenna circuit ismanufactured according to the method of manufacturing a device describedabove.

[0026] Also, the invention adopts an aspect of configuring electronicequipment by means of the aspects relating to a device described above.

BRIEF DESCRIPTION OF THE DRAWINGS

[0027]FIG. 1 is a cross sectional view showing part of a multilayerwiring pattern according to an embodiment of the invention.

[0028]FIG. 2 is a cross sectional view showing a first step in a methodof forming a multilayer wiring pattern, according to an embodiment ofthe invention.

[0029]FIG. 3 is a cross sectional view showing a second step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0030]FIG. 4 is a cross sectional view showing a third step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0031]FIG. 5 is a cross sectional view showing a fourth step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0032]FIG. 6 is a cross sectional view showing a fifth step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0033]FIG. 7 is a cross sectional view showing a sixth step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0034]FIG. 8 is a cross sectional view showing a seventh step in themethod of forming a multilayer wiring pattern, according to theembodiment of the invention.

[0035] FIGS. 9(a)-9(c) are views showing a configuration of a multilayerwiring board according to an embodiment of the invention, 9(a) being afront view showing a substrate (main substrate), 9(b) being a front viewshowing a provisional substrate, on which wirings constituting a firstlayer are formed, and 9(c) being a front view showing an insulating filmconstituting the first layer.

[0036] FIGS. 10(a) and 10(b) are views showing a configuration of amultilayer wiring board according to an embodiment of the invention,10(a) being a front view showing a first layer with the insulating filmof FIG. 9(c) bonded to the provisional substrate of FIGS. 9(b), and10(b) being a front view showing a state, in which the first layer isbonded to the substrate shown in FIG. 9(a).

[0037] FIGS. 11(a) and 11(b) are views showing a configuration of amultilayer wiring board according to an embodiment of the invention,11(a) being a front view showing a provisional substrate, on whichwirings constituting a second layer are formed,, and 11(b) being a frontview showing an insulating film constituting the second layer.

[0038] FIGS. 12(a) and 12(b) are views showing a configuration of amultilayer wiring board according to an embodiment of the invention,12(a) being a front view showing a second layer with the insulating filmof FIG. 11(b) bonded to the provisional substrate of FIG. 11(a), and12(b) being a front view showing a state, in which the second layer isbonded to the first layer shown in FIG. 10(b).

[0039]FIG. 13 is a perspective view showing a non-contact type cardmedium comprising a monolayered wiring pattern with a circuit elementinterposed between a main substrate and a first layer according to anembodiment of the invention.

DETAILED DESCRIPTION

[0040] An explanation will be given below to a method of manufacturing adevice, according to the invention, and embodiments of a device, anon-contact type card medium, and an electronic equipment with referenceto the drawings.

[0041] In addition, a droplet discharge method referred to in theinvention is one, in which liquid droplets are discharged into a desiredregion to form a desired pattern including a substance being discharged,and the method is in some cases called an ink jet method. In this case,however, discharged liquid droplets do not correspond to so-called inkused in printing but comprise a liquid body containing a materialconstituting a device, the material containing, for example, aconductive substance constituting a device, or a substance capable offunctioning as an insulating substance. Further, droplet discharging isnot limited to atomizing at the time of discharging but includes thecase where droplets of a liquid body are continuously (successively)discharged drop by drop.

[0042]FIG. 1 is a cross sectional view showing part of a multilayerwiring pattern according to an embodiment. In the figure, the referencenumeral 1 denotes a substrate, 2A terminals, 2B1, 2B2 and 2B3 wirings,3B1, 3B2 and 3B3 adhesive layers, 4B1, 4B2 and 4B3 insulating layers(adhesive material), and P12, P23, P3 through-holes. The substrate 1 isa substrate made of, for example, glass.

[0043] The terminals 2A are made of a conductive material to makespecific wirings constituting a part of wirings, which are embedded inthe substrate 1 by processing the substrate 1. The wirings 2B1 among therespective wirings 2B1, 2B2 and 2B3 together with the adhesive layer 3B1and the insulating layer 4B1 constitute a first layer, the wirings 2B1being bonded to the insulating layer 4B1 by the adhesive layer 3B1 andconnected to the terminals 2A and the through-holes P12 in the substrate1. The wirings 2B2 together with the adhesive layer 3B2 and theinsulating layer 4B2 constitute a second layer, the wirings 2B2 beingbonded to the insulating layer 4B2 by the adhesive layer 3B2 andconnected to the through-holes P12 and the through-hole P23. The wirings2B3 together with the adhesive layer 3B3 and the insulating layer 4B3constitute a third layer, the wirings 2B3 being bonded to the insulatinglayer 4B3 by the adhesive layer 3B3 and connected to the through-holeP23 and the through-hole P3.

[0044] The adhesive layer 3B1 among the respective adhesive layers 3B1,3B2 and 3B3 is provided on a lower surface of the insulating layer 4B1to bond the insulating layer 4B1 to the terminals 2A, the wirings 2B1,and the substrate 1. The adhesive layer 3B2 is provided on a lowersurface of the insulating layer 4B2 to bond the insulating layer 4B2 tothe wirings 2B2 and the insulating layer 4B1 of the first layer. Theadhesive layer 3B3 is provided on a lower surface of the insulatinglayer 4B3 to bond the insulating layer 4B3 to the wirings 2B3 and theinsulating layer 4B2 of the second layer.

[0045] The respective insulating layers 4B1, 4B2 and 4B3 are formedfrom, for example, polyimide, the insulating layer 4B1 being provided toensure electric insulation between the first layer and the second layer,the insulating layer 4B2 being provided to ensure electric insulationbetween the second layer and the third layer, and the insulating layer4B3 being provided to ensure electric insulation between the third layerand a fourth layer, illustration of which is omitted. In addition, inFIG. 1 the respective adhesive layers 3B1, 3B2 and 3B3 and therespective wirings 2B1, 2B2 and 2B3 are exaggeratedly depicted inthickness relative to the respective insulating layers 4B1, 4B2 and 4B3for the sake of convenience. An actual thickness of the respectiveinsulating layers 4B1, 4B2 and 4B3 is fairly larger than that of therespective adhesive layers 3B1, 3B2 and 3B3 and the respective wirings2B1, 2B2 and 2B3.

[0046] The through-holes P12 among the respective through-holes P12,P23, P3 are formed in a state, in which they extend through theinsulating layer 4B1 of the first layer in a vertical direction, thusconnecting the wirings 2B1 of the first layer and the wirings 2B2 of thesecond layer together. The through-hole P23 is formed in a state, inwhich it extends through the insulating layer 4B2 of the second layer inthe vertical direction, thus connecting the wirings 2B2 of the secondlayer and the wirings 2B3 of the third layer together. The through-holeP3 is formed in a state, in which it extends through the insulatinglayer 4B3 of the third layer in the vertical direction, thus connectingthe wirings 2B3 of the third layer and the wiring of the fourth layertogether.

[0047] Thus the multilayer wiring pattern is formed in a state toprovide a multilayered structure on the substrate 1 and featured in sucha structure that the terminals 2A and the respective wirings 2B1, 2B2and 2B3 are placed in a desired state of connection by positioning ofthe respective layers and bonded in a multilayered manner by therespective adhesive layers 3B1, 3B2 and 3B3.

[0048] In addition, of course, a wiring pattern may be constituted by amonolayer, that is, only the first layer and the substrate 1 instead ofa multilayer. In this case, since there is no need of forming thethrough-holes P12 through the insulating layer 4B1 of the first layer,there is used an insulating layer 4B1 in a completely flat shape, inwhich through-holes are not provided for formation of the through-holesP12. Also, a desired wiring pattern may be formed from a substratewithout the terminals 2A, that is, a substrate with only the wirings 2B1of the first layer.

[0049] Further, it is conceivable that a chip-shaped circuit element beinterposed between the substrate 1 and the first layer. In this case, itis necessary to position the circuit element so that joining terminalsof the circuit element are connected to the terminals 2A of thesubstrate 1 or the wirings 2B1 of the first layer.

[0050] Subsequently, a method of forming the multilayer wiring patternwill be described in detail with reference to FIGS. 2 to 8. In addition,FIGS. 2 to 8 are process drawings showing respective steps includingfirst to seventh steps in the method of forming the multilayer wiringpattern.

[0051] In the first step, a conductive liquid L, for example, a liquidcontaining fine silver particles being a metal is discharged by theinkjet system through an ink jet head H onto a provisional substrate 5,which is provided by first depositing a peel film 5 b on a surface of aflat-shaped backing material 5 a as shown in FIG. 2. The peel film 5 bpossesses a repellent property of a desired level. And the conductiveliquid L adhering to the peel film 5 b of the provisional substrate 5 ina pattern is subjected to heat treatment (baking treatment) in atemperature environment of around 300° C. to make the wirings 2B1(silver wiring) of the first layer (second step) as shown in FIG. 3.

[0052] When the wirings 2B1 are thus formed on the provisional substrate5 (more particularly, directly on the peel film 5 b), through-holes 4 afor the through-holes P12 are first formed as shown in FIG. 4 and aninsulating film provided on an underside thereof with the adhesive layer3B1 is bonded to the wirings 2B1 (third step). In this case, theinsulating film constitutes the insulating layer 4B1, the insulatingfilm being positioned so that the through-holes 4 a are disposed justabove the predetermined wirings 2B1, and bonded to the wirings 2B1 and apart (portion, in which the wirings 2B1 are absent) of the peel film 5 bby the adhesive layer 3B1.

[0053] In this state, the provisional substrate 5 together with the peelfilm 5 b is peeled off to be removed (fourth step) as shown in FIG. 5.Since the peel film 5 b possesses a favorable repellent property, it isexcellent in peel property and so is easily peeled off from the adhesivelayer 3B1. And in place of the provisional substrate 5, a mainsubstrate, that is, the substrate 1 is bonded to the insulating filmwith the adhesive layer 3B1 therebetween as shown in FIG. 6 (fifthstep). When the fifth step is completed, formation of the first layer onthe substrate 1 is completed.

[0054] With such way of forming the first layer, instead of dischargingthe conductive liquid L directly on the substrate 1 to form the wirings2B1, the conductive liquid L is discharged directly on the provisionalsubstrate 5 (more particularly, the peel film 5 b), on which a repellentproperty of a desired level is ensured, to form the wirings 2B1, andthen bonded to the substrate 1, so that the wirings 2B1 having beenformed on the basis of the ink jet system can be arranged on thesubstrate 1 irrespective of a material of the substrate 1, that is, arepellent property of the substrate 1.

[0055] When the first layer is thus formed, the ink jet head H has theconductive liquid L discharged toward areas of the peripheral edges ofthe through-holes 4 a (sixth step) as shown in FIG. 7. As a result,surface tension acts to adhere the conductive liquid L to the wirings2B1, the peripheral edges and areas of the upper ends of thethrough-holes 4 a in a bridge-like manner as shown in the figure. In thesame manner as in the second step, the through-holes P12 (silverthrough-holes) shown in FIG. 8 are then formed by subjecting theconductive liquid L to heat treatment (baking treatment) in atemperature environment of around 300° C. (seventh step). Further, byrepeating the above respective steps, upper layers, that is, the secondlayer, the third layer, . . . and the through-holes P23, P3, . . .connecting the respective layers together are formed, and finally themultilayer wiring pattern shown in FIG. 1 is finished.

[0056] Further, configurations of multilayer wiring boards manufacturedon the basis of the method of forming a multilayer wiring pattern willbe described particularly with reference to front views shown in FIGS. 9to 12. In addition, the multilayer wiring boards are two-layered boardscomposed of the substrate 1, the first layer, and the second layer, andan explanation will be given to structures of respective constituentscorresponding to the above description.

[0057]FIG. 9 is a front view showing the provisional substrate 5 and theinsulating film (the insulating layer 4B1), which constitute the firstlayer, and a structure of the substrate 1. In FIG. 9, (a) is a frontview showing the substrate 1 (main substrate), (b) is a front viewshowing the provisional substrate 5 in a state, in which the wirings 2B1of the first layer are formed, and (c) is a front view showing theinsulating film (the insulating layer 4B1) of the first layer.

[0058] As shown in FIG. 9(a), the terminals 2A are first embedded in themain substrate 1 to be formed. Also, the wirings 2B1 are formed as linepatterns, which assume predetermined shapes and are arranged inpredetermined positions, on the provisional substrate 5 by the ink jetsystem as shown in FIG. 9(b), while a plurality of through-holes 4 a forformation of the through-holes P12 are arranged in predeterminedpositions and a terminal opening 4 b for exposing the terminals 2A isformed centrally of the insulating layer 4B1 as shown in FIG. 9(c). Inaddition, the main substrate 1, the provisional substrate 5, and theinsulating film 4B1 are set to assume a square-shaped outward form andtheir outward forms are set such that the provisional substrate 5 andthe insulating layer 4B1 are of the same size and the main substrate 1is somewhat larger than the provisional substrate 5 and the insulatinglayer 4B1.

[0059] Also, in FIG. 10, (a) is a front view showing a state, in whichthe insulating layer 4B1 is overlapped on the provisional substrate 5 tobe bonded thereto, and (b) is a front view showing a state, in which theinsulating layer bonded to the provisional substrate 5 is bonded to thesubstrate 1, that is, a state, in which the first layer is formed on thesubstrate 1.

[0060] The provisional substrate 5 and the insulating layer 4B1, whichassume the same outward form, are overlapped on each other in a state,in which they are positioned relative to each other, and adhered to eachother by the adhesive layer 3B1 provided on an underside of theinsulating layer 4B1 as shown in FIG. 10(a). In this state, therespective through-holes 4 a are positioned just above the predeterminedwirings 2B1. And such insulating layer 4B1 is positioned relative to andbonded to the main substrate 1 as shown in FIG. 10(b) in a state, inwhich the provisional substrate 5 is removed, that is, only the wirings2B1 are bonded to the insulating layer 4B1. In this state, therespective terminals 2A on the main substrate 1 contact with thepredetermined wirings 2B1 in a partially overlapping state and theremaining portions of the terminals are exposed outside the terminalopening 4 b.

[0061] Subsequently, FIG. 11 is a front view showing structures of theprovisional substrate 5 and an insulating film (insulating layer 4B2),which constitute a second layer. In FIG. 11, (a) is a front view showingthe provisional substrate 5 in a state, in which wirings 2B2 of thesecond layer are formed, and (b) is a front view showing the insulatingfilm (insulating layer 4B2) of the second layer. As shown in FIG. 11(a),the wirings 2B2 for connecting the wirings 2B1 of the first layer to oneanother are formed as line patterns, which assume predetermined shapesand are arranged in predetermined positions, on the provisionalsubstrate 5 by means of the ink jet system.

[0062] Also, a plurality of through-holes 4 a for formation of thethrough-holes P23 are arranged in predetermined positions in theinsulating layer 4B2 and a terminal opening 4 b for exposing theterminals 2A on the main substrate 1 is formed centrally of theinsulating layer 4B2 as shown in FIG. 11(b). Like the provisionalsubstrate 5 and the insulating layer 4B1, which constitute the firstlayer, the provisional substrate 5 and the insulating layer 4B2 are setto assume a square-shaped outward form and are of the same size inoutward form.

[0063] When the insulating layer 4B2 is positioned on the provisionalsubstrate 5 to be overlapped on and bonded to the provisional substrate,the respective through-holes 4 a are positioned in predeterminedpositions on the wirings 2B2 as shown in FIG. 12(a). And when the inkjet system is used to form through-holes P12 in the respectivethrough-holes 4 a on the first layer shown in FIG. 10(a) and theinsulating layer 4B2 is positioned to be bonded, a two-layered wiringboard is finished as shown in FIG. 12(b). In the two-layered wiringboard, the wirings 2B1 of the first layer are connected to thepredetermined wirings 2B2 of the second layer through the through-holesP12, and thus a desired circuit is formed by the wirings 2B1 of thefirst layer and the wirings 2B2 of the second layer, which are connectedto each other. And various signals and electric power are supplied fromthe outside through, for example, contact pins, or the like, to therespective terminals 2A, which are exposed outside the terminal opening4 b.

[0064] Subsequently, FIG. 13 is a perspective view showing an exampleconfiguration of a non-contact type card medium comprising a monolayeredwiring board with a chip circuit element (IC chip 7) interposed betweena substrate 1 (main substrate) and a first layer. Two wirings 2B1 arebonded to an underside of an insulating layer 4B1. One of the wirings2B1 is set to assume a shape of an open loop to constitute a loopantenna as shown in the figure, and the other of the wirings 2B1 is setto assume a substantially straight shape. Meanwhile, two terminals 2Aare formed by providing a wiring in a predetermined position on thesubstrate 1 and arranging an insulating film 6 on the wiring, and the ICchip 7 in the form of a bare chip is bonded and fixed in thepredetermined position. Externally connected terminals 7 a, 7 b areprovided on an upper surface of the IC chip 7.

[0065] When the insulating layer 4B1 is positioned on the thusconfigured substrate 1 to be bonded thereto, the substantially straightwiring 2B1 has its end thereof overlapping and connecting to theexternally connected terminal 7 a and its other end overlapping andconnecting to one of the terminals 2A as shown in the figure. Also, theopen-loop wiring 2B1 has its one end overlapping and connecting to theexternally connected terminal 7 b and its other end overlapping andconnecting to the other of the terminals 2A. That is, the IC chip 7 isconnected by the respective wirings 2B1, so that a non-contact type cardmedium including a loop antenna circuit is formed. At least one ofelectromagnetic waves and static capacity coupling performs at least oneof electricity supply and data transfer between the non-contact typecard medium and an external transmitting and receiving apparatus (notshown).

[0066] As described above, the invention comprises the steps of formingwirings by application of heat treatment after the ink jet system isused to discharge a conductive liquid onto a provisional substratehaving a predetermined repellent property, bonding an insulating film tothe wirings with an adhesive material therebetween, peeling and removingthe provisional substrate, and bonding and fixing the wirings togetherwith the insulating film on a main substrate by an adhesive material, sothat the ink jet system can be used to form favorable wiringsirrespective of a quality of a substrate material. That is, instead ofdischarging a conductive liquid directly onto that main substrate, onwhich wirings are to be actually formed, to form a wiring pattern as ina conventional art with the use of the ink jet system, a conductiveliquid is discharged onto a provisional substrate, which ensures arepellent property of a certain level, to previously form wirings andthe wirings together with an insulating film are bonded and fixed to amain substrate by an adhesive material, so that there is no need ofsubjecting the main substrate to surface preparation to impart arepellent property of a certain level to the main substrate and so theforming step of multilayer wirings with the use of the ink jet systemcan be simplified correspondingly.

[0067] The entire disclosure of Japanese Patent Application No.2002-119447 filed Apr. 22, 2002 is incorporated by reference.

What is claimed is:
 1. A method of manufacturing a device, comprisingthe steps of: (a) forming first wirings on a provisional substrate; (b)mounting an insulating body on the first wirings to form a laminatedbody of the first wirings and the insulating body; (c) peeling off thelaminated body from the provisional substrate; and (d) mounting thelaminated body on a main substrate.
 2. The method of manufacturing adevice, according to claim 1, wherein in the step (a), before the firstwirings are formed, a surface of the provisional substrate is made topossess a property permitting the first wirings and the provisionalsubstrate to peel off in the step (c).
 3. The method of manufacturing adevice, according to claim 2, wherein the property permitting the firstwirings and the provisional substrate to peel off comprises a repellentproperty.
 4. The method of manufacturing a device, according to claim 1,wherein in the step (a), the first wirings are formed by means of adroplet discharge method.
 5. The method of manufacturing a device,according to claim 1, wherein the step (b) comprises bonding aninsulating film to the first wirings.
 6. The method of manufacturing adevice, according to claim 1, wherein in the step (d), second wiringsare first formed on the main substrate, and the laminated body ismounted on the main substrate in a manner to provide conduction betweenthe second wirings and the first wirings.
 7. The method of manufacturinga device, according to claim 1, wherein in the step (d), circuitterminals are first formed on the main substrate, and the laminated bodyis mounted on the main substrate in a manner to provide conductionbetween the circuit terminals and the first wirings.
 8. The method ofmanufacturing a device, according to claim 1, wherein openings areformed in the insulating body to expose at least a part of the firstwirings.
 9. The method of manufacturing a device, according to claim 8,wherein the openings are first formed on the insulating body prior tothe step (b).
 10. The method of manufacturing a device, according toclaim 8, further comprising, after the step (d), (e) forming aconductive layer in the openings.
 11. The method of manufacturing adevice, according to claim 10, wherein the step (e) further comprises adroplet discharge method.
 12. The method of manufacturing a device,according to claim 11, wherein the droplets comprise liquid bodiescontaining fine metallic particles.
 13. The method of manufacturing adevice, according to claim 1, wherein multilayer wirings are formed byforming at least one or more new laminated bodies on the laminated bodywhich is performed in the same step as that in which the laminated bodyis formed.
 14. A device manufactured by the manufacturing methodaccording to claim
 1. 15. A non-contact type card medium comprising anantenna circuit manufactured by the manufacturing method according toclaim
 1. 16. Electronic equipment comprising a device according to claim14.